yep, i built a couple board designs with ground planes using that method, setting ground fill seeds, and such, and just letting fritzing make the connections to the plane. both for thru hole and surface mount components. problem is the pins or pads connected using the default settings are dang hard to solder to by hand. pretty much need to have the solder iron way hot and wait for ever to get a good solder joint. its not a show stopper issue, i was just wondering if there were some tricks in the board design process that would help make the soldering easier. I recently noticed there is a setting for the ground fill keepout distance or something similar. maybe that can be used to decrease the area used on a ground fill seed connection to a plane. lots of things still to investigate in fritzing for me. thanks for the input.
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