If you are going to hand solder this, then I'm glad I was lazy and left the pad width at its current .22mm instead of the .3mm recommended in the Infineon part. While it will make placement a bit more tricky there is a touch more space between pads to avoid solder bridges. I see you have connected the heat sink copper on the bottom of the chip to ground which is probably a good bet. The data sheet calls it pin 0 but doesn't show it as connected to anything, so it shouldn't mind being ground. Good luck, and tell us how you make out 
edit: Looking closer at the gerber output with gerbv, you may want to straighten the connections in to the thermal heat sink. They both bend a bit from the vertical and thus reduce the spacing between pins. Same with many of the other connections in to the IC pads. Given the distances I think you want as much separation as possible to avoid solder bridges (although the two on the copper pad are probably the ones most at risk as they will be under the chip and not accessable).
Peter