Either module will work fine in fritzing. BUT if used on a 2-layer board only, I would call it a BETA unit used for designs and in-house reference only. NOT used in a final product to customers/friends ect. YOU cannot properly perform the PCB design and layer stack requirements to be FCC complaint.(start page 84) NOW I’m no pro, but can clearly see the Figure 91 requires this for an end version of your product to be FCC complaint.
As you can see in Figure 92, layup is easily possible inside fritzing. You just need to start on page 84 to understand the facts of this FCC compliance requirement. Anyhow, compliance is a whole other deal, and not covered here.
BUT according to Figure 91, you can meet Top and mid-layer1 requirements with fritzing. YOU are just missing Dielectric 2, mid-layer 2, Dielectric 3, mid-layer3. Peter is correct, fritzing cannot do that. BUT you can however have the board-house building your board, add these addition layers to your PCB, for your product to supposedly be compliant. Regardless, a easy workaround if you only need to layup on the top-side. Peters part will work a treat for anyone needing to use this module. Just note and read the .PDF and understand the FCC compliance guidelines.
Parts here should be labeled EXPERIMENTAL, for BETA purposes only… Just to cover peter’s parts actual requirements. Which cannot be met using fritzing.