Not a problem, folks here helped me when I was a beginner and it is in all our interest to encourage and help people make more parts. I owe you an apology because I didn't look closely enough at the core dip part. It is in fact wrong in pcb view (and schematic as well for that matter). I'm fixing that up and will post a corrected part in a bit when I figure out what Inkscape is doing with the hole size in your pcb, your current hole size is way to big but the scaling is odd (not uncommon with Inkscape unfortunatly).
edit: OK, fixed that by my usual method: copy in a pad that is correct and change the current ones to match. In pcb I changed the square pad to pin 1 and changed the hole size from .041 to .035 (IC pin size), still much bigger than the recommended .024 in the data sheet. Schematic I swapped in the one from the dip relay and set it to be the same as one of the configurations. I didn't bus the pins that are common (1 and 14 and 7 and 8) which should be done if this is the configuration you want. I fixed up some scaling issues in the original. In all three views I changed the pin numbers to start at 0, and in the fzp file removed the spice data for the op amp which no longer applies. In breadboard I added the breadboard layerId which was missing (the only thing I know that affects is exporting the part as an svg). So this part should do what you want with a correct pcb view. You may need to edit schematic if you want one of the different pin configurations.
HE721.fzpz (8.3 KB)
Peter
